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Tensilica, Inc. and HyperSilicon Co., Ltd. Partner

By DE Editors

HyperSilicon Co., Ltd, (Beijing, China, is Tensilica, Inc.’s (Santa Clara, CA) new SOC (system-on-chip) prototyping partner, bringing to the relationship the support of both the Xtensa customizable processors and the Diamond Standard processor cores in the growing China market. Designing FPGA development boards is HyperSilicon’s specialty. The boards are used to test new chip designs before the chip is produced in silicon.

The intent is that HyperSilicon will be able to utilize Tensilica’s dataplane processor cores with Altera FPGA-based boards for SOC emulation before silicon production, which is expected to reduce verification time. This may be useful for customers who want to make sure their SOC designs work correctly in the system, so they prototype their SOC designs before committing them to silicon.
For more information, visit Tensilica.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE's editors contribute news and new product announcements to Desktop Engineering. Press releases can be sent to them via DE-Editors@deskeng.com.
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