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Mentor Graphics Announces Integrated Solution for Component-to-System Thermal Characterization and Analysis

By DE Editors

Mentor Graphics announced a combined technology for thermal characterization and simulation with T3Ster thermal transient hardware test products for semiconductor device packages and LEDs, and its FloTHERM software for electronics thermal simulation. According to the company, the interface between T3Ster and FloTHERM creates accurate thermal simulation models. The solution is also JESD51-14 compliant.

The integrated solution provides a combined methodology of optimizing heat management in devices, sub-systems and full systems. Manufacturers can optimize their LED and IC package designs for effective heat dissipation. Once the device prototype is built, they can then characterize the device from a thermal perspective and build accurate models for use in FloTHERM thermal software simulations at both the sub-system and full system levels. Finally, systems integrators can further verify their heat management solutions with physical measurements using the T3ster hardware.

For more information, visit Mentor Graphics.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE's editors contribute news and new product announcements to Desktop Engineering. Press releases can be sent to them via DE-Editors@deskeng.com.
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