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LPKF Introduces Laser Direct Structuring for 3D Circuits

By DE Editors

LPKF Introduces Laser Direct Structuring for 3D Circuits

LPKF Laser & Electronics has introduced the new Fusion3D 1100, which is designed to create 3D circuits and laser-structuring of molded interconnect devices (MID) for small volume production.

The Fusion3D 1100 has uses laser direct structuring technology (LDS) and MID to combine both mechanical structures and electronic circuits into a single 3D part. MID consists of circuit traces embedded into molded thermoplastics, which creates an electrical pathway. The 3D circuits are structured by using LDS-grade resin, which is laser activated by a scanner-based laser system. The circuit pattern is written directly on the molded piece and conductive paths are plated using electroless plating technology, adhering only to where the plastic has been activated by the laser beam. 

“With its compact size, substantially lower price, and advanced technology, the new LPKF laser structuring system creates an opportunity for further growth of affordable LDS technology,” says Dr. Ingo Bretthauer, CEO of LPKF Laser & Electronics.

LPKF is expecting to start delivery of the Fusion3D 1100 systems to North American customers in July 2011.

For more information, visit LPKF Laser & Electronics.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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DE's editors contribute news and new product announcements to Desktop Engineering. Press releases can be sent to them via DE-Editors@deskeng.com.