Intel has released details on its next-generation Intel Xeon Phi processors, currently codenamed Knights Landing, which will extend the benefits of code modernization investments, the company states. The various options in the next generation technology include a new high-speed fabric and on-package memory.
The Omni Scale Fabric is designed to address the requirements of the next generations of high-performance computing, and will be integrated into Xeon Phi and Xeon processors to optimize performance, scalability, reliability, power and density of HPC deployments.
Knights Landing will be available as a standalone processor or a PCIe-based card. It will include up to 16GB high bandwith, on-package memory and deliver five times better bandwith compared to GDDR-based memory, the company states. It is also expected to deliver more than 3 TFLOPS of double-precision performance and three times the single-threaded performance compared with the current generation.
“Intel is re-architecting the fundamental building block of HPC systems by integrating the Intel Omni Scale Fabric into Knights Landing, marking a significant inflection and milestone for the HPC industry,” said Charles Wuischpard, vice president and general manager of Workstations and HPC, Intel. “Knights Landing will be the first true many-core processor to address today’s memory and I/O performance challenges.”
Knights Landing processors are expected to be implemented in HPC systems in the later half of 2015.
For more information, visit Intel.
Sources: Press materials received from the company and additional information gleaned from the company’s website.