Home / Design / Consona Releases Cimnet Systems’ Engenix v3.3 Engineering Solution for PCB

Consona Releases Cimnet Systems’ Engenix v3.3 Engineering Solution for PCB

By DE Editors

Consona Corporation has announced the general availability of Engenix Version 3.3.0 "Cimnet Systems’ engineering automation software for printed circuit board (PCB) manufacturing. Engenix v3.3.0 provides PCB manufacturers with tools for stack-up and traveler automation, job management, communication and collaboration. It integrates CAM, shop floor, and business data.

Version 3.3.0 includes several new features which are focused on improving the specific requirements of Rigid-Flex circuits. These features include a stack-up editor which allows users to define both the final customer product as well as the manufacturing details required for Rigid-Flex PCB’s, and flex-connector and secondary rigid sections that can be added to accommodate complex designs. Other features include impedance calculations that automatically take into account material changes in the flex sections for transmission lines originating the primary rigid section, and optional 3D graphics.

“Our recent focus has been on enhancing capabilities for complex HDI structures for rigid boards and even though our solutions were able to support Rigid-Flex and Flex PCBs, we’ve continued to listen to our customers and add key features to better meet their requirements,” said Iain Wilson, product manager, Consona. “We’re excited to say that with the release of v3.3.0 and the upcoming release of v3.4, we’ll have leading solutions for all three major types of PCB.”

For more information, visit Consona Corporation and Cimnet Systems.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

About DE Editors

DE's editors contribute news and new product announcements to Desktop Engineering. Press releases can be sent to them via DE-Editors@deskeng.com.
Scroll To Top