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ANSYS 14.5 Available

By DE Editors

ANSYS 14.5 is now available. The solution includes new multiphysics capabilities integrated with the ANSYS Workbench platform that the company says will enable improved engineering productivity and innovation.

The update delivers a number of new multiphysics solutions and enhancements to pre-processing and meshing capabilities, as well as a new parametric high-performance computing (HPC) licensing model to make design exploration more scalable.

“It’s no secret that while today’s products are getting smarter, they’re also becoming more complex,” said Jim Cashman, president and CEO at ANSYS. “Having a holistic view of the product requirements and design is crucial to reduce design uncertainty and ultimately create a successful product. Our customers are depending on the depth and breadth of ANSYS 14.5 and our Workbench platform to confidently predict how their products will perform and, at the end of the day, provide good value and satisfaction to their customers.”

The new HPC Parametric Pack amplifies the available licenses for individual applications (pre-processing, meshing, solve, HPC, post-processing), enabling simultaneous execution of multiple design points while consuming just one set of application licenses.

The solution introduces its first chip "package "system (CPS) design flow. This coupled approach addresses multidisciplinary requirements from the first phase of the design process and results in a final product whose individual components work together as an integrated system. ANSYS 14.5’s new CPS design flow links ANSYS subsidiary Apache Design’s integrated circuit (IC) power analysis products to ANSYS’ electromagnetic field simulation products. Additionally, the power delivery network channel builder automatically connects electronic package models from ANSYS SIwave to IC power simulations in Apache’s RedHawk and Totem for increased convenience.

ANSYS TGrid functionalities are integrated in the ANSYS Fluent environment in version 14.5 to further reduce pre-processing time. CAD readers and new advanced surface meshing capabilities are also integrated and available in a single user environment.  Additionally, meshing enhancements allow for higher-quality hexahedral meshes that result in smaller problem size and overall reduced solver time.

The solution also includes extended fluid-thermal capabilities, such as two-way coupling between fluid simulation in ANSYS Fluent and electromagnetic field simulation in ANSYS Maxwell. The ANSYS Workbench platform supports the efficient coupling of multiple physics models and, when paired with this new feature, users can quickly and accurately predict losses and understand the effects of temperature on material performance in electromechanical devices such as motors and transformers, the company says.

With the integration of recently acquired ANSYS subsidiary Esterel Technologies’ SCADE Suite with ANSYS Simplorer in version 14.5, companies can virtually validate power electronic and mechatronic systems earlier in the design process by simulating the embedded software with the hardware, including electrical, mechanical and fluidic subsystems.

The ANSYS HFSS for ECAD capability contributes to accuracy by enabling engineers to run complex 3-D HFSS simulations directly from the ANSYS Designer layout-based interface and from other popular layout-based ECAD environments.

For more information, visit ANSYS.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

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