EnvisionTEC announced the newest 3D printer in its 3SP line, the Xede 3SP, at the Euromold 2013 Show last week.
Earlier in 2013, the company introduced its 3SP (Scan, Spin and Selectively Photocure) technology. This approach to 3D printing employs a multi-cavity laser diode with an orthogonal mirror spinning at 20,000 rpm. According to the company, one of the advantages of this technology is that it expands on the build size capability of EnvisionTEC's DLP technology, enabling it to produce 3D printers with a large format.
With a build envelope of 18-in. x 18-in. x 18-in., the Xede 3SP allows for the production of large 3D parts, build at fast build speeds. Parts can be printed quickly from STL files regardless of geometric complexity with no signs of stairstepping on the inner and outer surfaces, the company says.
The company has targeted the printer at industries including aerospace, animation, automotive, architecture and art, consumer packaged goods, electronics, manufacturing, sporting goods, and toys.
For more information, visit EnvisionTEC.
Sources: Press materials received from the company and additional information gleaned from the company's website.