Dear Desktop Engineering Reader:
A couple of weeks ago, I wrote about the PreSys, a pre- and post-processor finite element modeling toolset from Engineering Technology Associates (ETA). PreSys is a core component of the company’s Inventium Suite of integrated analysis and simulation applications. Well, as ETA promised in that vodcast I wrote about, they've been busy: ETA just announced version 5.8 of its DYNAFORM die system simulation solution. Here’s why I thought the announcement was interesting.
ETA describes DYNAFORM as a complete die system simulation solution and cites two reasons: One, DYNAFORM has tools that cover the entire die system process — CAD surface and CAE meshing, estimation (i.e., material utilization, piece price, scrap calculation, etc.), die simulation, and die analyses. Two, the software’s interface gives you easy-to-use, single location access to all those tools.
In terms of brass tacks, this means that DNYAFORM gives you tools for guided cost estimation, quoting, die face design, and formability analysis. Not done yet. You can virtually move a part from one station to the next through the stamping process inside a plant. You can simulate trimming, shedding, and scrap removal. You can analyze die structural integrity, and even simulate part behavior during shipping. The net effect of all this is said to be that you bypass soft tooling steps and reduce tryout time, which, in turn, should reduce costs, minimize waste, and increase productivity.
Neat. But that’s not what caught my eye. Version 5.8 of DYNAFORM has been enhanced with something ETA calls “INC.” INC is an explicit FEA solver engineered for sheet-metal forming simulations. It is a virtual tryout tool for die face design. It supports — “adequately” in the company's word — non-conforming CAD surfaces, which could eliminate most mesh repairs. Simulation setups are said to quick and efficient. Training is minimal.
In short, DYNAFORM 5.8 sounds like something to — ahem — die for. You can learn more about ETA's DYNAFORM 5.8 as well as its Inventium Suite from today's Pick of the Week write-up. There are links to more on INC and a link to sign-up for evaluations of ETA's software, including DYNAFORM version 5.8.
Thanks, pal. And have a happy new year. — Lockwood
Anthony J. Lockwood
Editor at Large, Desktop Engineering
Read today's Pick of the Week write-up.
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